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Microelectronics Packaging Handbook, Part II: Semiconductor Packaging (Microelectronics Packaging Handbook)
Microelectronics Packaging Handbook Part II Semiconductor Packaging - Microelectronics Packaging Handbook
Author: R.R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein
This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volum...  more »
ISBN-13: 9780412084416
ISBN-10: 0412084414
Publication Date: 1/31/1997
Pages: 651
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Publisher: Springer
Book Type: Hardcover
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