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Electronic Packaging: Design, Materials, Process, and Reliability
Electronic Packaging Design Materials Process and Reliability
Author: John H. Lau, Wataru Nakayama, John Prince, C.P. Wong
The ultimate, up-to-the-minute electronic packaging resource The ever-increasing pin counts and clock speeds of modern electronics continue to "push the performance envelope" with regard to designing packaging and interconnection solutions that can meet increasingly challenging requirements. Here's the help you need! For the first time,...  more »
ISBN-13: 9780070371354
ISBN-10: 0070371350
Publication Date: 2/1/1998
Pages: 496
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Publisher: McGraw-Hill Professional
Book Type: Hardcover
Members Wishing: 0
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