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Search - Area Array Packaging Handbook: Manufacturing and Assembly

Area Array Packaging Handbook: Manufacturing and Assembly
Area Array Packaging Handbook Manufacturing and Assembly
Author: Ken Gilleo
*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)
ISBN-13: 9780071374934
ISBN-10: 0071374930
Publication Date: 11/5/2001
Pages: 1,000
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Publisher: McGraw-Hill Professional
Book Type: Hardcover
Members Wishing: 0
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